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Shany Joseph & Girish Phatak
Electroplating of Lead Free Solder for Electronics

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Bìa của Shany Joseph & Girish Phatak: Electroplating of Lead Free Solder for Electronics (PDF)

The form and composition of solders used in electronics has undergone many changes throughout the history of electronics. The solder form has changed from wires and ingots to pastes, while the composition has changed from 50Sn/50Pb to eutectic 63Sn/36Pb and a range of intermediate compositions. Today, electronics needs a reliable process that can deposit solder films with a suitable lead-free composition and form solders bumps up to 10’s of micron size upon reflow. Amongst the various options, Sn and its binary and ternary alloys with Cu, Ag, Bi and In are amongst the contenders for the coveted lead-free solder slot. This new book presents and discusses the innovations being made in electroplating of lead free solder for electronics.

€73.28

định dạng PDF ● Trang 67 ● ISBN 9781617282607 ● Biên tập viên Shany Joseph & Girish Phatak ● Nhà xuất bản Nova Science Publishers ● Được phát hành 2016 ● Có thể tải xuống 3 lần ● Tiền tệ EUR ● TÔI 7219709 ● Sao chép bảo vệ Adobe DRM

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Shany Joseph Girish Phatak Gerard Gleason Thomas R. Victor

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