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Johan Liu & Olli Salmela 
Reliability of Microtechnology 
Interconnects, Devices and Systems

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Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book’s focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.


The book also includes exercises and detailed solutions at the end of each chapter.

€149.79
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Inhaltsverzeichnis

Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.

Sprache Englisch ● Format PDF ● Seiten 204 ● ISBN 9781441957603 ● Dateigröße 3.8 MB ● Verlag Springer New York ● Ort NY ● Land US ● Erscheinungsjahr 2011 ● herunterladbar 24 Monate ● Währung EUR ● ID 2150098 ● Kopierschutz Adobe DRM
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