Joy Laskar & Sudipto Chakraborty 
Advanced Integrated Communication Microsystems 

Learn the fundamentals of integrated communication microsystems

Advanced communication microsystems–the latest technology
to emerge in the semiconductor sector after
microprocessors–require integration of diverse signal
processing blocks in a power-efficient and cost-effective manner.
Typically, these systems include data acquisition, data processing,
telemetry, and power management. The overall development is a
synergy among system, circuit, and component-level designs with a
strong emphasis on integration.

This book is targeted at students, researchers, and industry
practitioners in the semiconductor area who require a thorough
understanding of integrated communication microsystems from a
developer’s perspective. The book thoroughly and carefully
explores:

* Fundamental requirements of communication microsystems

* System design and considerations for wired and wireless
communication microsystems

* Advanced block-level design techniques for communication
microsystems

* Integration of communication systems in a hybrid environment

* Packaging considerations

* Power and form factor trade-offs in building integrated
microsystems

Advanced Integrated Communication Microsystems is an ideal
textbook for advanced undergraduate and graduate courses. It also
serves as a valuable reference for researchers and practitioners in
circuit design for telecommunications and related fields.

Table of Content

Preface.

Acknowledgements.

Chapter 1: Fundamentals of Communication Systems.

Introduction.

1.1 Communication systems.

1.2 History and Overview of Wireless Communication Systems.

1.3 History and Overview of Wired Communication Systems.

1.4 Communication System Fundamentals.

1.5 Electromagnetics.

1.6 Analysis of circuits and systems.

1.7 Broadband, wideband and narrowband systems.

1.8 Semiconductor technology and devices.

1.9 Key circuit topologies.

1.10 Gain/Linearity/Noise.

Conclusion.

Chapter 2: Wireless Communication Systems Architectures.

Introduction.

2.1 Fundamental considerations.

2.2 Link Budget Analysis.

2.3 Propagation Effects.

2.4 Interface Planning.

2.5 Superheterodyne architecture.

2.6 Low IF architecture.

2.7 Direct conversion architecture.

2.8 Two stage direct conversion.

2.9 Current mode architecture.

2.10 Subsampling architecture.

2.11 Multi-band direct conversion radio.

2.12 Polar modulator.

2.13 Harmonic reject architectures.

2.14 Practical considerations for transceiver integration.

Conclusion.

Chapter 3: Systems Architectures for High Speed Wired Communications.

3.1 Introduction.

3.2 Band-limited channel.

3.3 Equalizer system study.

References.

Chapter 4: Mixed Signal Communication Systems Building Blocks.

Introduction.

4.1 Inverters.

4.2 Static D flipflop.

4.3 Bias circuits.

4.4 Transconductor cores.

4.5 Load networks.

4.6 A versatile analog signal processing core.

4.7 Low noise amplifier.

4.8 Power amplifiers.

4.9 Balun.

4.10 Signal Generation Path.

4.11 Mixers.

4.12 Baseband filters.

4.13 Signal strength indicator (SSI).

4.14 ADC/DAC.

Conclusion.

Chapter 5 Examples of Integrated Communication Microsystems.

Introduction.

5.1 Direct conversion receiver front-end.

5.2 Debugging: A practical scenario.

5.3 High speed wired communication example.

Conclusion.

References.

Chapter 6: Low voltage, low power and low area designs.

Introduction.

6.1. Power consumption considerations.

6.2 Device technology and scaling.

6.3 Low voltage design techniques.

6.4 Injection locked techniques.

6.5. Subharmonic architectures.

6.6. Superregenerative architectures.

6.7. Hearing aid applications.

6.8. Radio frequency identification tags.

6.9. Ultra low power radios.

Conclusion.

References.

Chapter 7: Packaging for Integrated Communication Microsystems.

Introduction.

7.1. Background.

7.2 Elements of a package.

7.4 Driving Forces for RF Packaging Technology.

7.5 MCM Definitions and Classifications.

7.6 RF – SOP modules.

7.7 Package modeling and optimization.

7.8 Future packaging trends.

7.9 Chip Package Co-design.

7.10 Package models and transmission lines.

7.11 Calculations for package elements.

7.12 Cross-talk.

7.13 Grounding.

7.14 Practical issues in working with packages.

7.15 Chip-package codesign examples.

7.16 Wafer scale package.

7.17 Filters using bondwire.

7.18 Packaging Limitation.

Conclusion.

References.

Chapter 8: Advanced SOP Components and Signal Processing.

Introduction.

8.1 History of compact design.

8.2 Previous Techniques in Performance Enhancement.

8.3 Design Complexities.

8.4 Modeling Complexities.

8.5 Compact Stacked Patch Antennas Using LTCC Multilayer Technology.

8.6 Suppression of Surface Waves and Radiation Pattern Improvement Using SHS Technology.

8.7 Radiation-Pattern Improvement Using a Compact Soft Surface Structure .

8.8 A Package-Level Integrated Antenna Based on LTCC Technology.

Chapter 9: Characterization and Computer aided analysis of integrated microsystems.

Introduction.

9.1 Computer aided analysis of wireless systems.

9.2 Measurement equipments and their operation.

9.3 Network analyzer calibration.

9.4 Wafer probing measurement.

9.5 Characterization of integrated radios.

9.6 In the laboratory.

About the author

Joy Laskar, Ph D, holds the Schlumberger Chair in Microelectronics in the School of Electrical and Computer Engineering at Georgia Tech. He is also founder and Director of the Georgia Electronic Design Center, where he heads a research group that focuses on the integration of high-frequency mixed-signal electronics for next-generation wireless and wire line systems.

Sudipto Chakraborty, Ph D, is a research staff member at Texas Instruments, where he is involved in architecting and designing advanced system-on-chip mixed signal systems using silicon-based technologies. He has authored or coauthored several technical articles, journals, and books, and has served on the technical program committee for various IEEE conferences and journals.

Manos M. Tentzeris, Ph D, is an Associate Professor in the School of Electrical and Computer Engineering at Georgia Tech. He is also the Associate Director of the Georgia Electronic Design Center in the area of RFID/Sensors and heads the ATHENA group, which focuses on 3D integration and packaging, multiband/ultrawideband antennas and antenna arrays, wearable/flexible inkjet-printed electronics, CNT/graphene, and integrable power scavenging.

Franklin Bien, Ph D, is an Assistant Professor at Ulsan National Institute of Science and Technology (UNIST), Korea, home for Hyundai/Kia Motor Company. He cofounded and leads the UNIST Electronic Design Center (UEDC) focusing on analog/mixed-signal and RF ICs for wireless communications and ubiquitous connectivity for automotive information technology applications.

Anh-Vu Pham, Ph D, is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published extensively and received the National Science Foundation CAREER Award in 2001 and the 2008 Outstanding Young Engineer Award from the IEEE Microwave Theory and Techniques Society. He cofounded RF Solutions and Planar Mag, Inc., and has been an active consultant for industry.