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Thomas Moore
Characterization of Integrated Circuit Packaging Materials

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Cover of Thomas Moore: Characterization of Integrated Circuit Packaging Materials (PDF)

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

€54.98

Language English ● Format PDF ● Pages 274 ● ISBN 9781483292342 ● Editor Thomas Moore ● Publisher Elsevier Science ● Published 2013 ● Downloadable 3 times ● Currency EUR ● ID 5737073 ● Copy protection Adobe DRM

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