State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that s changing the nature of printed circuit boards–and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.
€112.93
भाषा अंग्रेज़ी ● स्वरूप PDF ● पेज 594 ● ISBN 9780071382991 ● प्रकाशक McGraw-Hill Education ● प्रकाशित 2001 ● डाउनलोड करने योग्य 3 बार ● मुद्रा EUR ● आईडी 5651144 ● कॉपी सुरक्षा Adobe DRM
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