Penulis: Jan Van der Spiegel

Xilin Liu received the B.S. degree in Electrical Engineering from the Harbin Institute of Technology, China, in 2011. He received the M.S. and the Ph.D. degrees in Electrical Engineering from the University of Pennsylvania in 2013 and 2017, respectively. He joined Qualcomm Inc. in 2017. His research interests include analog and mixed-signal integrated circuits and system design for medical applications, brain-machine interface, data converters, and CMOS sensors. Dr. Liu received the IEEE Solid-State Circuits Society (SSCS) 2015-16 Predoctoral Achievement Award, the Best Student Paper Award of the 2017 International Symposium on Circuits and Systems (ISCAS), the Best Paper Award (1st place) of the 2015 Biomedical Circuits and Systems Conference (Bio CAS), and the Best Paper Award of the Bio CAS Track of the 2014 International Symposium on Circuits and Systems (ISCAS).  He is also the recipient of the Student-Research Preview Award (Honorable Mention) of the 2014 IEEE International Solid-State Circuits Conference (ISSCC).   Jan Van der Spiegel is a Professor of the Electrical and Systems Engineering, and the Director of the Center for Sensor Technologies at the School of Engineering and Applied Science at the University of Pennsylvania. He is the former chair of the Electrical Engineering and interim chair of the Electrical and Systems Engineering Departments. Dr. Van der Spiegel received his Master”s degree in Electro-Mechanical Engineering and his Ph.D. degree in Electrical Engineering from the University of Leuven, Belgium, in 1974 and 1979, respectively. His primary research interests are in mixed-mode VLSI design, bio-inspired CMOS vision sensors, biologically based image sensors and sensory information processing systems, and brain-machine interface electronics. He has published over 250 journal and conference papers, and is the co-author of 8 U.S. patents. He is a life fellow of the IEEE, received the IEEE Major Educational Innovation Award, and is the recipient of the IEEE Third Millennium Medal, the UPS Foundation Distinguished Education Chair and the Bicentennial Class of 1940 Term Chair. He received the Christian and Mary Lindback Foundation, and the S. Reid Warren Award for Distinguished Teaching, the IBM Young Faculty Development Award and the Presidential Young Investigator Award. He has served on several IEEE program committees (IEDM, ICCD, ISCAS, and ISSCC) and was the technical program chair of the 2007 International Solid-State Circuit Conference (ISSCC 2007). Dr. Van der Spiegel is an associate Editor of the IEEE Tr. of Biomedical CAS, and section Editor of Electrical and Electronic Engineering of the J. of Engineering of the IET, and former Editor of Sensors and Actuators A for North and South America. He has been the chair of the IEEE SSCS Chapters committee from 1998 to 2015. He is currently the President of the IEEE Solid-State Circuits Society. He is a member of Phi Beta Delta and Tau Beta Pi. He spent a six-month sabbatical at Tsinghua University, Beijing, as a distinguished visiting scholar in 2017-2018.