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Thomas Moore
Characterization of Integrated Circuit Packaging Materials

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Copertina di Thomas Moore: Characterization of Integrated Circuit Packaging Materials (PDF)

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

€55.01

Lingua Inglese ● Formato PDF ● Pagine 274 ● ISBN 9781483292342 ● Editore Thomas Moore ● Casa editrice Elsevier Science ● Pubblicato 2013 ● Scaricabile 3 volte ● Moneta EUR ● ID 5737073 ● Protezione dalla copia Adobe DRM

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