J. Paulo Davim & Mark J. Jackson 
Nano and Micromachining 

This book provides the fundamentals and recent advances in nano and micromachining for modern manufacturing engineering. It begins by providing an outline of nanomachining with emphasis being given to molecular dynamics, cutting, and chip formation, before discussing various advances in field and machining processes, including advances in diamond cutting tools, conventional processes (microturning, microdrilling, micromilling, etc.), grinding and ultra-precision processes, and non-conventional machining processes (laser micromachining, EDM micromachining, etc.).

The coverage concludes with an evaluation of subsurface damages in nano and micromachining and a presentation of applications in industry. As such, not only is this book useful to those studying engineering or machining at both an undergraduate and postgraduate level, but it also serves as a useful reference guide for academics and engineers involved in these areas and related industries.

Зміст

Preface.

Chapter 1. Nanoscale Cutting (Rüdiger RENTSCH).

1.1. Introduction.

1.2. Basic elements of molecular dynamics modeling.

1.3. Design and requirements for state-of-the-art MD cutting process simulations.

1.4. Capabilities of MD for nanoscale material removal process analysis.

1.5. Advances and recent developments in material removal process simulation.

1.6. Summary and outlook.

1.7. References.

Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces (Xiaoping LI).

2.1. Introduction.

2.2. The mechanism of ductile mode cutting of brittle materials.

2.3. The chip formation in cutting of brittle materials.

2.4. Machined surfaces in relation to chip formation mode.

2.5. References.

Chapter 3. Diamond Tools in Micromachining (Waqar AHMED, Mark J. JACKSON and Michael D. WHITFIELD).

3.1. Introduction.

3.2. Diamond technology.

3.3. Preparation of substrate.

3.4. Modified HFCVD process.

3.5. Nucleation and diamond growth.

3.6. Deposition on complex substrates.

3.7. Diamond micromachining.

3.8. Conclusions.

3.9. References.

Chapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling (Wit GRZESIK).

4.1. Introduction.

4.2. Microturning.

4.3. Microdrilling.

4.4. Micromilling.

4.5. Product quality in micromachining.

4.6. References.

Chapter 5. Microgrinding and Ultra-precision Processes (Mark J. JACKSON and Michael D. WHITFIELD).

5.1. Introduction.

5.2. Micro and nanogrinding.

5.3. Nanogrinding tools.

5.4. Conclusions.

5.5. References.

Chapter 6. Non-Conventional Processes: Laser Micromachining (Grant M. ROBINSON and Mark J. JACKSON).

6.1. Introduction.

6.2. Fundamentals of lasers.

6.3. Laser microfabrication.

6.4. Laser nanofabrication.

6.5. Conclusions.

6.6. References.

Chapter 7.Evaluation of Subsurface Damage in Nano and Micromachining (Jianmei ZHANG, Jiangang SUN and Zhijian PEI).

7.1. Introduction.

7.2. Destructive evaluation technologies.

7.3. Non-destructive evaluation technologies.

7.4. Acknowledgements.

7.5. References.

Chapter 8. Applications of Nano and Micromachining in Industry (Jiwang YAN).

8.1. Introduction.

8.2. Typical machining methods.

8.3. Applications in optical manufacturing.

8.4. Semiconductor and electronics related applications.

8.5. Summary.

8.6. Acknowledgements.

8.7. References.

List of Authors.

Index.

Про автора

J. Paul Davim works for KINNSYS, Brussels, Belgium.

Mark Jackson works for Jackson Ashcroft Associates, London, UK.