Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Andrew E. Perkins & Suresh K. Sitaraman
Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Ngôn ngữ Anh ● định dạng PDF ● Trang 192 ● ISBN 9780387793948 ● Kích thước tập tin 7.3 MB ● Nhà xuất bản Springer US ● Thành phố NY ● Quốc gia US ● Được phát hành 2008 ● Có thể tải xuống 24 tháng ● Tiền tệ EUR ● TÔI 2146326 ● Sao chép bảo vệ DRM xã hội