Gerald Gerlach & Wolfram Dotzel 
Introduction to Microsystem Technology 
A Guide for Students

Over half a century after the discovery of the piezoresistive
effect, microsystem technology has experienced considerable
developments. Expanding the opportunities of microelectronics to
non-electronic systems, its number of application fields continues
to increase. Microsensors are one of the most important fields,
used in medical applications and micromechanics. Microfluidic
systems are also a significant area, most commonly used in ink-jet
printer heads.

This textbook focuses on the essentials of microsystems
technology, providing a knowledgeable grounding and a clear path
through this well-established scientific dicipline. With a
methodical, student-orientated approach, Introduction to
Microsystem Technology covers the following:

* microsystem materials (including silicon, polymers and thin
films), and the scaling effects of going micro;

* fabrication techniques based on different material properties,
descriptions of their limitations and functional and shape elements
produced by these techniques;

* sensors and actuators based on elements such as mechanical,
fluidic, and thermal (yaw rate sensor components are
described);

* the influence of technology parameters on microsystem
properties, asking, for example, when is the function of a
microsystem device robust and safe?

The book presents problems at the end of each chapter so that
you may test your understanding of the key concepts (full solutions
for these are given on an accompanying website). Practical examples
are included also, as well as case studies that enable a better
understanding of the technology as a whole. With its extensive
treatment on the fundamentals of microsystem technology, this book
also serves as a compendium for engineers and technicians working
with microsystem technology.

表中的内容

Preface.

List of Symbols.

List of Abbreviations.

1 Introduction.

1.1 What is a Microsystem?

1.2 Microelectronics and Microsystem Technology.

1.3 Areas of Application and Trends of Development.

1.4 Example: Yaw Rate Sensor.

2 Scaling and Similarity.

2.1 Scaling.

2.2 Similarity and Dimensionless Numbers.

3 Materials.

3.1 Overview.

3.2 Single Crystalline Silicon.

3.3 Glasses.

3.4 Polymers.

3.5 Thin Films.

3.6 Comparison of Material Characteristics.

4 Microfabrication.

4.1 Overview.

4.2 Cleanliness During Production.

4.3 Lithography.

4.4 Thin-film Formation.

4.5 Layer Patterning.

4.6 Anisotropic Wet Chemical Deep Etching.

4.7 Doping.

4.8 Bonding Techniques.

4.9 Insulation Techniques.

4.10 Surface Micromachining.

4.11 Near-surface Micromachining.

4.12 HARMST.

4.13 Miniaturized Classical Techniques.

4.14 Selection of Microtechnical Manufacturing Techniques.

5 Packaging.

5.1 Tasks and Requirements.

5.2 Functions of Packaging.

6 Function and Form Elements in Microsystem
Technology.

6.1 Mechanical Elements.

6.2 Fluidic Elements.

6.3 Thermal Elements.

7 Sensors and Actuators.

7.1 Reversible and Parametric Transducers.

7.2 Transducers for Sensors and Actuators.

8 Design of Microsystems.

8.1 Design Methods and Tools.

8.2 Systems with Lumped Parameters.

8.3 Systems with Distributed Parameters.

9 Effect of Technological Processes on Microsystem
Properties.

9.1 Parameter-based Microsystem Design.

9.2 Robust Microsystem Design.

10 The Future of Microsystems.

10.1 Status and Trends in Microsystem Technology.

10.2 Microoptical Applications.

10.3 Probe Tips.

10.4 RF Microsystems.

10.5 Actuators.

10.6 Microfluidic Systems.

10.7 Chemical, Biological and Medical Systems.

10.8 Energy Harvesting and Wireless Communications.

10.9 Micro Fuel Cells.

References.

Appendix A Physical Constants.

Appendix B Coordinate Transformation.

B.1 Elastic Coefficients.

B.2 Piezoresistive Coefficients.

References.

Appendix C Properties of Silicon Dioxide and Silicon Nitride
Layers.

References.

Appendix D Nomenclature of Thin-film Processes.

Reference.

Appendix E Adhesion of Surface Micromechanical
Structures.

E.1 Capillary Forces.

E.2 Critical Length of Cantilever Springs.

Reference.

Index.

关于作者

Gerald Gerlach is currently a Professor for Solid-state
Sensors at the Dresden University of Technology, Germany, a post he
has held since 1996. His research interests include micromachined
solid-state sensors (pressure, humidity, chemical) and sensor
fabrication techniques, and he teaches courses in Microtechnology
and Sensors. He has also held positions as a Researcher at
different German companies making micromachined pressure sensors
for biomedical applications, and is active in the sensor and
measuring technology fields, having been Chairman of the German
Association of University Professors in Measuring Technology (AHMT)
and Vice-President of the German Society for Measurement and
Control (GMA) since 2002. He has co-authored the German version of
this book Einführung in die Mikrosystemtechnik (Hanser,
2006) and has contributed chapters to the book Functional
Elements in Precision Engineering (Hanser) and Fabrication
in Precision Engineering and Microtechnology (Hanser, 1995). He
has also written over 250 journal and conference papers, and holds
more than 35 patents.

Wolfram Dötzel is currently Professor for
Microsystems and Precision Engineering at Chemnitz University of
Technology, also holding the position of Vice-President for
Research at the university. His main research fields are in the
modelling, design and simulation of micromechanical components,
characterization and testing of micromechanical components by
experimental methods, and adaptation of methods and principles of
precision engineering for microsystems. He teaches courses in
Microsystems, reliability and the design of devices and has
previously co-authored Einführung in die
Mikrosystemtechnik (Hanser, 2006) with Gerald Gerlach. He has
also authored a chapter in the book Manual of Data
Acquisition (Verlag Technik, 1984), more than 130 publications
in journals and conference proceedings on micromechanical and
precision engineering components as well as modelling, simulation,
and characterization, and holds 8 patents.